BDN09-3CB/A01
CTS Thermal Management Products
Product No:
BDN09-3CB/A01
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEATSINK CPU W/ADHESIVE .91"SQ
Quantity:
2045 In Stock
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
2.7075
2.7075
10
2.64005
2.64005
25
2.56918
2.56918
50
2.4263
2.4263
100
2.28361
2.28361
250
2.140844
2.140844
500
2.069499
2.069499
1000
1.855407
1.855407
5000
1.819725
1.819725
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Product Information
Parameter Info
User Guide
| Mfr | CTS Thermal Management Products |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 0.910" (23.11mm) |
| Length | 0.910" (23.11mm) |
| Series | BDN |
| Package | Box |
| Diameter | - |
| Material | Aluminum |
| Fin Height | 0.355" (9.02mm) |
| Shelf Life | 24 Months |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Base Product Number | BDN09 |
| Thermal Resistance @ Natural | 26.90°C/W |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | 9.60°C/W @ 400 LFM |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
